“Matric is committed to providing safe, effective products and services to the electronic control and computer industries that meet all known customer performance and reliability requirements. The Matric quality management system is dedicated to using defined techniques and behaviors to continually reduce variation in process and products – satisfying requirements of both internal and external customers. Matric is committed to complying with all applicable statutory and regulatory requirements and maintaining the effectiveness of the quality management system.
We strive to prevent defects by focusing on processes ultimately resulting in better product quality at reduced cost. These results are realized through the effective use of our greatest resource, our people, who are responsible and accountable for the quality of their work.
Matric Associates are committed to rapid organization response, providing our customers with the fastest concept-to-commercialization time in the electronics industry.
Matric will maintain an environment that fosters continual quality improvement in all areas of its operations.”
Certified Quality Systems
- Certified to ISO 9001 since September 30, 1996. Registered with Bureau Veritas Certification – Certificate number US10000040. AS 9100 & 9001 Certificate
- Certified to AS 9100 since January 14, 2010. Register with Bureau Veritas Certification – Certificate number US10000040. AS 9100 & 9001 Certificate
- Certified to ISO 13485 since January 23, 2012. Registered with SARA Registrar- Certificate number SARA-2011-CA-0142-01-A. ISO 13485 Certificate 2015
- Certified by SIRA – Quality system complies with Directive 94/9/EC, Annexes IV and VII – Authorizes manufacture of equipment or protective systems components intended for use in potentially explosive atmospheres. Notification number EECS ATEX 3459. Matric is qualified to provide full turn-key ATEX manufacturing services. ATEX certified manufacturing ensures that your products meet the guidelines for intrinsically safe goods. Sira Certification 2015
- ATEX certified manufacturing services
- IECEx Quality Assessment Report
3D Automated Optical Inspection (AOI)
In-Circuit Test Equipment
- The ability to be able to test boards with up to 1296 nodes
- Boundary Scan: Boundary scan is a method for testing integrated circuits on PCBs.
- Established stimulus and responses are given to ICs to determine whether pins are shorted or open on the device.
- The ability to program flash devices
- VTEP: VTEP is a combination of hardware and software techniques, which enable improvements over the noise characteristics, stability, accuracy, and repeatability of measurements.
A custom bed of nails fixture is required to be purchased to test each unique board design.
- Trained electronic technicians use standard electronic instruments to bench test and troubleshoot electronic assemblies in accordance with written test procedures.
- Where justified by production volumes or other requirements, custom and / or computer based functional testers (board level and / or system) are developed to partially automate the functional test.
- Automatic functional testers (ATE) are also available for testing and troubleshooting electronic assemblies.
- Test failures are troubleshot, repaired and retested.
- Test records can be in the customer format, and maintained on file at Matric or provided with each shipment.
- Where specified, the cleanliness tester is used to verify printed circuit board assemblies are free of surface contaminants.
- Also referred to as “ionic contamination testing”.
- Contamination is expressed as a sodium chloride equivalency (micrograms / sq. in.).
- Test methodology is in accordance with IPC-TM-650, 184.108.40.206 (static method).
- Board sizes up to 15″ X 20″
- Capacity: 7 cubic feet chamber
- Range: – 75° C to +175° C
- 2 stage compressor for rapid cooling
- Programmable temperature cycles
- Unit Under Test can be powered and power cycle
- Performed quarterly
- Review all metrics
Corrective Action System
- Used to initiate and monitor internal and supplier corrective action.
- Preventive actions used to initiate improvements to prevent defects.
Process Improvement Teams:
- Apply TQM principles to improve manufacturing processes.
- Improve throughput / cycle time.
- Reduce defects and waste.
- Each associate submits at least 5 opportunities for improvement each year.
- Suggestions prioritized / tracked for effective implementation.
- IPC-A-610 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
- IPC-A-620 REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
- IPC-J-STD-001 REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
Matric has 3 IPC-certified instructors for each standard. Experienced in classes 1, 2, 3 covering all categories of electronics products (consumer, industrial, medical, etc.). or customer-specific workmanship standards.
- Internally using written procedures and traceable standards or
- Externally by an approved, ISO 9002 registered contractor
- Associate training
- Conductive floors (paint and carpet) throughout the facility
- Daily humidity monitoring
- Static resistant smocks
- Heel and wrist straps
- ESD work surfaces
- Quarterly audits of the ESD program
- Utilized ANSI / ESD S20.20-2007 ESD Association Standard for the Development of an Electrostatic Discharge Control Program for – Protection of Electrical and Electronic Parts, Assemblies and Equipment