Matric recently invested in an ASYS Divisio 2100 Ergo semi-automatic depanelizing system to enhance production capabilities. The new machine is utilized for the depanelizing or cutting apart of Printed Circuit Board assemblies that have multiple assemblies on a common board (panelized).
The operation of the router is controlled by computer software that is programmed to trim each pallet consistently. The end result is high quality finished edges on individual boards. Perhaps the biggest benefit for the Matric production team is the time that it takes (or doesn’t take) to depanlize boards on the Divisio. Time is also saved with the rotating fixture that allows for 2 complete set-ups to be utilized. While one is being trimmed the previously trimmed boards are removed and a new PCB is loaded and ready to swap positions and keep the cycle going. The machine has a built-in, self-cleaning system that vacuums away the board trimmings.