Matric has invested in a new Koh Young Zenith 3D AOI with revolutionary 3D measurement capabilities. The Zenith 3D AOI system measures the true profilometric shape of components, solder joints and patterns on assembled PCB’s with true 3 dimensional measurement, overcoming the shortcomings and vulnerabilities of 2D AOI.
The new machine is utilized immediately following SMT (Surface Mount Technology) operations to quickly and accurately verify build quality of PCB’s. The revolutionary machine with unparalleled technology will flag and quantify a variety of defects including: missing, offset, rotation, polarity, upside down, OCV, solder filet, billboarding, lifted lead, lifted body, tombstone, bridging and more.
“This machine provides the absolute cutting edge in AOI technology. The precision and accuracy of this machine is unequalled in the industry,” says Doug Bevier, SMT Manager. “Programming is simplified and much easier and the output data for rework is invaluable. It won’t be long until there are more of these machines at Matric.”
An additional advantage to the 3D capabilities of the Zenith AOI is when dealing with warped PCB’s. Oftentimes the pad positions defined by PCB CAD or Gerber files appear distorted. Thus, conventional inspection systems will become confused during the inspection process and will provide incorrect data to the user. PCB warp becomes more pronounced during the reflow process due to the high temperatures required for processing. The Zenith AOI compensates for board warp with respect to the ideal plane and adjusts the measurements accordingly.
For more information, please contact your Business Development Engineer at Matric.