Dynamic Blog

  • What Are RoHS 3 Substances & What's The Implementation Date?
    by Matric on February 18, 2019 at 2:55 pm

    There are major regulation change coming to electronics in Europe, and it’s important for everyone to take note, including U.S. manufacturers who sell to EU customers. […]

  • Capabilities of a Flying Probe Test
    by Tyler Vasbinder on February 15, 2019 at 4:40 pm

    PCB design is tricky. Depending on how complex your project is -- or how much is at stake if something fails -- you may need top-end testing before launching your product. […]

  • Outsourcing a Box Build Assembly? Here's How to ID a Great Partner
    by Matric on February 7, 2019 at 2:04 pm

    Box build assembly. Systems integration. Top level assembly. […]

  • MEMS Design Guide for PCB Electromechanical Assemblies
    by Tyler Vasbinder on February 4, 2019 at 2:39 pm

    Microelectromechanical systems, or MEMS, are the microscopic building blocks of current electronics. Look no further than the smartphone in your pocket -- these tiny devices make up many of the sensors in our phones that collect data like motion and image stabilization. These little pieces have opened up a world of possibilities for companies looking to innovate with their products and craft revolutionary new ones Here’s a quick-and-dirty MEMS design guide to help your PCB design for electromechanical assemblies compete with the best. […]

  • Get a Quicker Quote for PCB Prototype Sourcing in 5 Shortcuts
    by Matric on January 31, 2019 at 4:09 pm

    In an ideal world, getting a quote for prototype production from your electronics contract manufacturer (ECM) would go smoothly and quickly. But the reality of prototype quoting is much less streamlined than either original equipment manufacturers (OEMs) or ECMs would like. […]