Quality Control For Electronic Components | Dynamic Manufacturing | Pittsburgh


Quality Statement:
“To do right for our customers, our community, our owners…

We at Dynamic Manufacturing are committed to continual quality improvement in everything we do, dedicating ourselves to meeting the needs of those relying on us.”

Quality Policy:
“To do right for our customers, our community, our owners…

Dynamic Manufacturing is committed to providing safe, effective products and services to our customers that meet all known contractual, reliability, and regulatory requirements. The Dynamic quality management system is dedicated to using defined techniques and behaviors to continually reduce variation in process and products – satisfying both internal and external customers.

We strive to prevent defects by focusing on processes ultimately resulting in better product quality at reduced cost. These results are realized through the effective use of our greatest resource, our people, who are responsible and accountable for the quality of their work. Dynamic will maintain an environment that fosters continual quality improvement in all areas of its operations.


  • Assemblers and Technicians receive initial and follow-up training in the latest IPC-A-610 standard, ‘Acceptability of Electronic Assemblies,’ the recognized standard of quality.
  • We follow FDA’s Good Manufacturing Practices.”
  • Certified to ISO 9001 since August 30, 2010. Registered with DEKRA Certification, Inc., Certificate number 112096.00

    Please contact us for a copy of our quality certifications.

  • A flying prober is available to test both SMT and through-hole assembled printed circuit boards for manufacturing defects. Being a fixtureless test machine, the flying prober avoids the high cost of bed of nails fixtures; it is ideal for contacting leads of fineFlying Prober Machine pitch SMT components.

    Test programs for most printed circuit board assemblies can be developed from CAD data in about a day. Interfaces are available for most common CAD packages.

    The flying prober is equipped with optional features to detect open solder joints on most digital ICs.

    The flying prober also has a vision option, which permits a visual examination of components that cannot be electrically verified, such as bypass capacitors or capacitor polarity.

  • To complement our quality control inspection and testing methods, Dynamic offers automated optical inspection (AOI) of in-process PCB assemblies as well as solder paste inspection. AOI offers a more accurate and efficient alternative to visual inspection, involves comparatively less programming time than other MDA devices, and helps to deter solder joint defects and latent failures.

  • X-Ray inspection can be performed to provide a non-destructive, fast and thorough examination of the solder joints and electroX-Raynic components on a printed circuit board.

    The x-ray machine can view samples from angles 0 to 70 degrees, with 360 degree rotation. It has built-in modules to perform BGA, QFN, QFP and through-hole solder joint analysis.

    It can inspect with magnifications up to 23-320 times. At these magnifications, event the smallest defects in a product are readily visible, including those that are normally hidden beneath other components. Defects such as internal cracks, delamination, inclusion, improper mechanical fit or excessive porosity are easily visualize without damaging the product, so that it might be repaired instead of simply sliced up and discarded.

    • Trained electronic technicians use standard electronic instruments to bench test and troubleshoot electronic assemblies in accordance with written test procedures.
    • Where justified by production volumes or other requirements, custom and / or computer based functional testers (board level and / or system) are developed to partially automate the functional test.
    • Automatic functional testers (ATE) are also available for testing and troubleshooting electronic assemblies.
    • Test failures are troubleshot, repaired and retested.
    • Test records can be in the customer format, and maintained on file at Matric or provided with each shipment.
    • Where specified, the cleanliness tester is used to verify printed circuit board assemblies are free of surface contaminants.
    • Also referred to as “ionic contamination testing”.
    • Contamination is expressed as a sodium chloride equivalency (micrograms / sq. in.).
    • Test methodology is in accordance with IPC-TM-650, (static method).
    • Board sizes up to 15″ X 20″
  • Management Reviews of Quality System

    • Performed quarterly
    • Review all metrics

    Corrective Action System

    • Review all metrics
    • Preventive actions used to initiate improvements to prevent defects.
  • All measuring devices and instruments are calibrated:

    • Internally using written procedures and traceable standards or
    • Externally by an approved, ISO 9002 registered contractor
  • IPC Member since 1993.

    Default Workmanship Standards:



    Dynamic has 3 IPC-certified instructors.

    Experienced in classes 1, 2, 3 covering all categories of electronics products (consumer, industrial, medical, etc.). or Customer-specific Workmanship Standards.

  • All production and service associates are trained on precautions to prevent component damage from electrostatic discharge; refresher training is conducted annually.

    Workmanship Standrards Training – Training of visual acceptance criteria for Class 1, 2 & 3 electronic assemblies, including through hole and SMT).

    • Associate Training
    • Conductive floor (paint and carpet) in production areas
    • Static resistant smocks
    • Heel and wrist straps
    • ESD work surfaces
    • Complies with ANSI/ESD S20.20-1999 ESD Association Standard for the Development of an Electrostatic Discharge Control Program for – Protection of Electrical and Electronic Parts, Assemblies and Equipment