Matric Blog

  • Vital Elements of a Box Build Assembly
    by Tyler Vasbinder on September 18, 2018 at 4:49 pm

    Electromechanical box build assembly is a key service offered by electronics contract manufacturers. In addition to the manufacture and population of PCBs, this full turnkey production offers a simple, all-in-one approach to your manufacturing needs. This includes wire harnesses, metal fabrication, and sub-level assemblies. […]

  • Are Carbon Nanomaterials the Solution to Conflict Minerals?
    by Tyler Vasbinder on September 11, 2018 at 7:53 pm

    Conflict minerals are both a vital component (no pun intended) of the electronics industry and at the same time one of its biggest headaches. Since 2010, U.S.-based electronics companies have been required to determine whether certain components in their products came from the Democratic Republic of the Congo, one of the world’s largest sources of conflict minerals. […]

  • Easy as 123: The Differences in Class 1, Class 2 & Class 3 Electronics
    by Tyler Vasbinder on August 28, 2018 at 9:14 pm

    In electronics manufacturing, printed circuit boards are separated into three categories: 1, 2, and 3. The categories reflect the level of quality of each board type, from lowest (class 1 electronics) to highest (class 3 electronics). This classification system was developed and is monitored by IPC under the IPC-6011 standard. […]

  • ISO 13485 Certification: Everything You Need to Know
    by Tyler Vasbinder on August 13, 2018 at 4:22 pm

    Electronic contract manufacturers (ECMs) regularly tout the certifications they possess -- just take a look at their websites. Hey, even we do it. And it’s for good reason: Certifications communicate what your company is capable of to potential customers. It also communicates trustworthiness and dependability. If you’re a medical company seeking electronics manufacturing, the ISO 13485 certification is the most important one to you. […]

  • IPC Standards Chart for U.S.
    by Matric on August 9, 2018 at 4:25 pm

    The IPC standards chart (or tree, in some circles) provides guidelines for the production and assembly requirements of electronics manufacturing companies. Each “code” on the tree is a standard or document outlining the guidelines or requirements for building an assembly. […]

  • Who's to Blame for the Electronic Components Supply Shortage?
    by Tyler Vasbinder on August 6, 2018 at 4:18 pm

    Dating back to 2017, the electronic components supply shortage has become an increasingly challenging issue for companies that rely on the industry. A surge in use of components combined with a shortage of parts has snowballed into what’s become a highly constrained market. […]

  • RoHS 2 Compliance & Directives Checklist
    by Matric on August 3, 2018 at 4:07 pm

    In 2006, the European Union rolled out a directive restricting the use of certain hazardous chemicals. This directive, Restriction of Hazardous Substances (RoHS), would have a far-reaching impact on the electronics industry. Its restrictions on using lead would send manufacturers scrambling to revise their practices or adopt entirely new ones. Thanks to a follow-up directive in 2011, manufacturers now hustle to meet RoHS 2 compliance. Yes, it’s not a punitive law full of fines and penalties. But if you’re a U.S. company, noncompliance is basically an impassable barrier to entry to the EU trade market. So if you want to do business abroad, don’t mess around -- comply. […]

  • ICT Testing Vs Flying Probe Testing
    by Matric on August 1, 2018 at 1:15 pm

    Deciding on the best testing method for your printed circuit board can be a daunting task. There are plenty of factors to take into consideration, including costs, coverage, and development lead time. However, there are two popular test strategies you’ll often find yourself choosing between: ICT testing vs flying probe testing. […]

  • Your Guide to a Quicker Electronics Engineering Change Notice Process
    by Tyler Vasbinder on July 24, 2018 at 9:28 pm

    Change management is usually a requirement in the electronics industry. This specifically relates to changes needed after the initial design of your project. In the electronics industry, an engineering change notice (ECN) is the most common example of change management. […]

  • Beware These 6 Printed Circuit Board Layout Pitfalls
    by Matric on July 18, 2018 at 5:12 pm

    Printed circuit boards are vital components of many modern-day electrical gadgets. Printed circuit board layout is made up of numerous layers of copper traces and circuits that help make connections between various parts, as well as plastic and other types of materials that are used to cover and shield the connections from the surroundings. How you design and manufacture printed circuit boards (PCBs) largely determines how well these boards will work in the final product. Unfortunately, layout is becoming increasingly difficult and complicated, as new board circuit designs are being shrunk to fit in electrical devices that become becoming smaller and smaller each year. […]