“Matric is committed to providing safe, effective products and services to the electronic control and computer industries that meet all known customer performance and reliability requirements. The Matric quality management system is dedicated to using defined techniques and behaviors to continually reduce variation in process and products – satisfying requirements of both internal and external customers. Matric is committed to complying with all applicable statutory and regulatory requirements and maintaining the effectiveness of the quality management system.
We strive to prevent defects by focusing on processes ultimately resulting in better product quality at reduced cost. These results are realized through the effective use of our greatest resource, our people, who are responsible and accountable for the quality of their work.
Matric Associates are committed to rapid organization response, providing our customers with the fastest concept-to-commercialization time in the electronics industry.
Matric will maintain an environment that fosters continual quality improvement in all areas of its operations.”
- Certified to ISO 9001 since September 30, 1996. Registered with SARA Registrar – Certificate number SARA-2011-CA-0142-01-A. 9001 Certificate
- Certified to AS 9100D since January 14, 2010. Register with Bureau Veritas Certification – Certificate number US10000040. AS 9100D Certificate
- Certified to ISO 13485 since January 23, 2012. Registered with SARA Registrar- Certificate number SARA-2011-CA-0142-02-A. ISO 13485 Certificate 2016
- Certified by SIRA – Quality system complies with Directive 94/9/EC, Annexes IV and VII – Authorizes manufacture of equipment or protective systems components intended for use in potentially explosive atmospheres. Notification number EECS ATEX 3459. Matric is qualified to provide full turn-key ATEX manufacturing services. ATEX certified manufacturing ensures that your products meet the guidelines for intrinsically safe goods. SIRA Certification
- ATEX certified manufacturing services
- IECEx Quality Assessment Report
Production and inspection personnel have vision tests performed biannually to verify visual acuity. Visual inspection is performed by production operators and inspection personnel using the designated workmanship standards. Visual inspection may be with magnification (using equipment such as the Vision VS7) or with the naked eye. An Ersascope is used for visual inspection of BGA and SMT solder connections.
X-Ray inspection can be performed to provide a non-destructive, fast and thorough examination of the solder joints and electronic components on a printed circuit board X-ray is used for the non-destructive testing of PCB assemblies, semiconductor packages (BGA’s and leadless devices), encapsulated components, mechanical assemblies and other similar devices requiring x-ray test. Defects such as internal cracks, delaminations, inclusions, improper mechanical fit or excessive porosity are easily visualized without damaging the product, so that it might be repaired instead of destroyed. When combined with full automation and offline analysis, this allows a number of products to be checked with minimum input from the tester and minimum deviation from a standard test. Not only does this ensure that all products are tested equally thoroughly, it also gives added depth to the testing capabilities at Matric. The Y-Cheetah features a point-and-click style graphical interface. It also provides for high performance imaging by using a digital flat-panel detector, making it much easier to interpret possible failures.
To complement our quality control inspection and testing methods, Matric offers automated optical inspection (AOI) of in-process PCB assemblies. AOI offers a more accurate and efficient alternative to visual inspection, involves comparatively less programming time than other MDA devices, and helps to deter solder joint defects and latent failures. The latest AOI technology at Matric is 3D AOI. 3D AOI system measures the true profilometric shape of components, solder joints and patterns on assembled PCB’s with true 3 dimensional measurement. The 3D AOI will flag and quantify a variety of defects including: missing, offset, rotation, polarity, upside down, OCV, solder filet, billboarding, lifted lead, lifted body, tombstone, bridging and more.
In-circuit test is utilized for the automated testing of assemblies. Programs can be developed to verify the functionality of PCB assemblies. In-circuit test can be used to measure component values, find solder bridges, and detect open solder joints. It can also be used to power up the assembly and verify functionality. The Series 5 ICT system at Matric offers new analog measurement technology together with the industry’s fastest 12 MHz hybrid pin card. In addition, the new Agilent machine was ordered with the following options:
- The ability to be able to test boards with up to 1296 nodes
- Boundary Scan: Boundary scan is a method for testing integrated circuits on PCBs.
- Established stimulus and responses are given to ICs to determine whether pins are shorted or open on the device.
- The ability to program flash devices
- VTEP: VTEP is a combination of hardware and software techniques, which enable improvements over the noise characteristics, stability, accuracy, and repeatability of measurements.
A custom bed of nails fixture is required to be purchased to test each unique board design.
A flying prober is available to test both SMT and through-hole assembled printed circuit boards for manufacturing defects. Being a fixtureless test machine, the flying prober avoids the high cost of bed of nails fixtures; it is ideal for contacting leads of fine pitch SMT components. Test programs for most printed circuit board assemblies can be developed from CAD data in about a day. Interfaces are available for most common CAD packages. The flying prober is equipped with optional features to detect open solder joints on most digital ICs. The flying prober also has a vision option, which permits a visual examination of components that cannot be electrically verified, such as bypass capacitors or capacitor polarity.
- Trained electronic technicians use standard electronic instruments to bench test and troubleshoot electronic assemblies in accordance with written test procedures.
- Where justified by production volumes or other requirements, custom and / or computer based functional testers (board level and / or system) are developed to partially automate the functional test.
- Automatic functional testers (ATE) are also available for testing and troubleshooting electronic assemblies.
- Test failures are troubleshot, repaired and retested.
- Test records can be in the customer format, and maintained on file at Matric or provided with each shipment.
- Where specified, the cleanliness tester is used to verify printed circuit board assemblies are free of surface contaminants.
- Also referred to as “ionic contamination testing”.
- Contamination is expressed as a sodium chloride equivalency (micrograms / sq. in.).
- Test methodology is in accordance with IPC-TM-650, 184.108.40.206 (static method).
- Board sizes up to 15″ X 20″
A temperature chamber is available for temperature soaking or cycling of electronic assemblies, which may be powered or unpowered.
- Capacity: 7 cubic feet chamber
- Range: – 75° C to +175° C
- 2 stage compressor for rapid cooling
- Programmable temperature cycles
- Unit Under Test can be powered and power cycle
Management Reviews of Quality System
- Performed quarterly
- Review all metrics
Corrective Action System
- Used to initiate and monitor internal and supplier corrective action.
- Preventive actions used to initiate improvements to prevent defects.
Process Improvement Teams:
- Apply TQM principles to improve manufacturing processes.
- Improve throughput / cycle time.
- Reduce defects and waste.
- Each associate submits at least 5 opportunities for improvement each year.
- Suggestions prioritized / tracked for effective implementation.
IPC Member since 1993. Default Workmanship Standards:
- IPC-A-610 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
- IPC-A-620 REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
- IPC-J-STD-001 REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
Matric has 3 IPC-certified instructors for each standard. Experienced in classes 1, 2, 3 covering all categories of electronics products (consumer, industrial, medical, etc.). or customer-specific workmanship standards.
All measuring devices and instruments are calibrated:
- Internally using written procedures and traceable standards or
- Externally by an approved, ISO 9002 registered contractor
Hand Soldering Certification Program – Production and Service associates are trained and certified in hand soldering; associates are recertified on a biannual basis (40 hours for through-hole, 24 hours for SMT). Component Recognition – Production associates are trained to identify electronic components; retrained annually. Continuous Quality Improvement Training – All new associates undergo training on quality improvement techniques and the basic quality tools (15 hours minimum). ESD Training – All production and service associates are trained on precautions to prevent component damage from electrostatic discharge; refresher training is conducted annually. Workmanship Standards Training – Training of visual acceptance criteria for Class 1, 2 & 3 electronic assemblies, including through hole and SMT).
- Associate training
- Conductive floors (paint and carpet) throughout the facility
- Daily humidity monitoring
- Static resistant smocks
- Heel and wrist straps
- ESD work surfaces
- Quarterly audits of the ESD program
- Utilized ANSI / ESD S20.20-2007 ESD Association Standard for the Development of an Electrostatic Discharge Control Program for – Protection of Electrical and Electronic Parts, Assemblies and Equipment